Bracket, optical assembly and optical module

ABSTRACT

An optical module includes an electronic assembly and an optical assembly. The electronic assembly includes a circuit board and a chip component. The optical assembly disposed on the electronic assembly includes a bracket and an optical component. The bracket surrounds the chip component and has at least two conductive layers separated from each other. The conductive layers are electrically connected to the electronic assembly. The optical assembly is disposed on the bracket and has at least one light-transmissive conductive layer which is electrically connected to the conductive layers.

CROSS-REFERENCE TO RELATED PATENT APPLICATION

This application claims the benefit of priority to Taiwan PatentApplication No. 107120028, filed on Jun. 11, 2018. The entire content ofthe above identified application is incorporated herein by reference.

Some references, which may include patents, patent applications andvarious publications, may be cited and discussed in the description ofthis disclosure. The citation and/or discussion of such references isprovided merely to clarify the description of the present disclosure andis not an admission that any such reference is “prior art” to thedisclosure described herein. All references cited and discussed in thisspecification are incorporated herein by reference in their entiretiesand to the same extent as if each reference was individuallyincorporated by reference.

FIELD OF THE DISCLOSURE

The present disclosure relates to a bracket, and an assembly having thebracket and a module having the bracket, and more particularly to abracket, an optical assembly having the bracket, and an optical modulehaving the bracket.

BACKGROUND OF THE DISCLOSURE

Referring to FIG. 1, a conventional optical module 9 includes a circuitboard 91, a chip 92, a bracket 93, and an optical component 94. The chip92 is disposed on the circuit board 91. The bracket 93 is disposed onthe circuit board 91 and surrounds the chip 92. The optical component 94is disposed on the bracket 93. The chip 92 can be selected from alight-emitting chip or a light-sensing chip. When the light-emittingchip is adopted as the chip 92, the optical component 94 is selectedfrom a lens that has concentration, homogenization, or filtering effectaccording to particular implementations. When the light-sensing chip isadopted as the chip 92, the light collection effect or the light guidingpath needs to be considered so that a prism, a condenser lens or thelike can be selected as the optical component 94. The kind of theoptical component 94 selected seriously influences the performance ofthe optical module 9.

The conventional optical module 9 has been used in various fields, suchas lighting module of a portable electronic device, light source of anindicator light, or light sensing module for a fingerprint identifier.In conventional operation, the optical module 9 is inevitably shaken orcollided with, causing the optical component 94 to gradually loosen oreven slip out of the bracket 93. However, the conventional opticalmodule 9 does not have any design for detecting whether the opticalcomponent 94 has detached or not, hence necessitating improvement in therelevant art.

SUMMARY OF THE DISCLOSURE In response to the above-referenced technicalinadequacies, the present disclosure provides a bracket, an opticalassembly, and an optical module.

In one aspect, the present disclosure provides a bracket adapted to bemounted on a circuit board and support an optical component, includingat least two conductive layers separated from each other; wherein the atleast two conductive layers are electrically connected to the circuitboard.

In certain embodiments, the conductive layers are configured on one ofthe outer surface, the inner surface, and the interior of the bracket.

In certain embodiments, the bracket further includes at least twogrooves, and each of the conductive layers is respectively disposed ineach of the grooves.

In one aspect, the present disclosure provides an optical assembly,including a bracket and an optical component. The bracket includes atleast two conductive layers separated from each other. The opticalcomponent is disposed on the bracket, and the optical component includesat least one light-transmissive conductive layer which is electricallyconnected to the conductive layers.

In certain embodiments, the optical component further includes anoptical component body. The at least one light-transmissive conductivelayer is disposed on one of the upper surface and the lower surface ofthe optical component body, and the at least one light-transmissiveconductive layer includes two conductive ends disposed on two sides ofthe optical component body, respectively. The conductive layers areconfigured on one of the outer surface, the inner surface, and theinterior of the bracket. Each of the conductive layers includes aconnecting end extending to the inner surface of the bracket, and beingelectrically connected to the correspondingly conductive end. The atleast one light-transmissive conductive layer is electricallydisconnected from the conductive layers when the optical component isdetached from the bracket.

In certain embodiments, the bracket further includes at least twogrooves, and each of the conductive layers is respectively disposed ineach of the grooves. The optical component further includes an opticalcomponent body on which the at least one light-transmissive conductivelayer is disposed, the shape of the optical component body isrectangular, and the at least one light-transmissive conductive layerextends from one corner of the optical component body to anotheropposite corner thereof. The at least one light-transmissive conductivelayer is S-shaped or strip-shaped.

In one aspect, the present disclosure provides an optical module,including an electronic assembly and an optical assembly. The electronicassembly includes a circuit board and a chip component. The opticalassembly is disposed on the electronic assembly, and includes a bracketand an optical component. The bracket surrounds the chip component andincludes at least two conductive layers separated from each other. Theconductive layers are electrically connected to the electronic assembly.The optical assembly is disposed on the bracket and includes at leastone light-transmissive conductive layer which is electrically connectedto the conductive layers.

In certain embodiments, the optical component further includes anoptical component body, and the at least one light-transmissiveconductive layer is disposed on one of the upper surface and the lowersurface of the optical component body. The at least onelight-transmissive conductive layer includes two conductive endsdisposed on two sides of the optical component body, respectively. Theconductive layers are configured on one of the outer surface, the innersurface, and the interior of the bracket. Each of the conductive layersincludes a connecting end extending to the inner surface of the bracket,and being electrically connected to the correspondingly conductive end.The at least one light-transmissive conductive layer is electricallydisconnected from the conductive layers when the optical component isdetached from the bracket.

In certain embodiments, the bracket further includes at least twogrooves, and each of the conductive layers is respectively disposed ineach of the grooves. The optical component further includes an opticalcomponent body on which the at least one light-transmissive conductivelayer is disposed. The shape of the optical component body isrectangular, and the at least one light-transmissive conductive layerextends from one corner of the optical component body to anotheropposite corner thereof. The at least one light-transmissive conductivelayer is S-shaped or strip-shaped.

In certain embodiments, the width of the conductive layer is larger thanthe width of the light-transmissive conductive layer.

Therefore, the circuit of the electronic assembly can detect whether theoptical component is detached from the bracket through the conductivelayers of the bracket, and can perform corresponding protectionmeasures.

These and other aspects of the present disclosure will become apparentfrom the following description of the embodiment taken in conjunctionwith the following drawings and their captions, although variations andmodifications therein may be affected without departing from the spiritand scope of the novel concepts of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will become more fully understood from thedetailed description and the accompanying drawings, in which:

FIG. 1 is a cross-sectional view illustrating a conventional opticalmodule;

FIG. 2 is a perspective view illustrating a first embodiment of thepresent disclosure;

FIG. 3 is a cross-sectional view taken along a line of FIG. 2,illustrating the first embodiment;

FIG. 4 is a cross-sectional view illustrating another configuration ofthe first embodiment;

FIG. 5 is a top view illustrating an optical component of the firstembodiment;

FIG. 6 is a top view illustrating another configuration of the opticalcomponent of the first embodiment;

FIG. 7 is a cross-sectional view illustrating a second embodiment of thepresent disclosure;

FIG. 8 is a cross-sectional view illustrating a third embodiment of thepresent disclosure;

FIG. 9 is a cross-sectional view illustrating another variation of thethird embodiment of the present disclosure; and

FIG. 10 is a cross-sectional view illustrating a fourth embodiment ofthe present disclosure

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

The present disclosure is more particularly described in the followingexamples that are intended as illustrative only since numerousmodifications and variations therein will be apparent to those skilledin the art. Like numbers in the drawings indicate like componentsthroughout the views. As used in the description herein and throughoutthe claims that follow, unless the context clearly dictates otherwise,the meaning of “a”, “an”, and “the” includes plural reference, and themeaning of “in” includes “in” and “on”. Titles or subtitles can be usedherein for the convenience of a reader, which shall have no influence onthe scope of the present disclosure.

The terms used herein generally have their ordinary meanings in the art.In the case of conflict, the present document, including any definitionsgiven herein, will prevail. The same thing can be expressed in more thanone way. Alternative language and synonyms can be used for any term(s)discussed herein, and no special significance is to be placed uponwhether a term is elaborated or discussed herein. A recital of one ormore synonyms does not exclude the use of other synonyms. The use ofexamples anywhere in this specification including examples of any termsis illustrative only, and in no way limits the scope and meaning of thepresent disclosure or of any exemplified term. Likewise, the presentdisclosure is not limited to various embodiments given herein. Numberingterms such as “first”, “second” or “third” can be used to describevarious components, signals or the like, which are for distinguishingone component/signal from another one only, and are not intended to, norshould be construed to impose any substantive limitations on thecomponents, signals or the like.

First Embodiment

Referring to FIG. 2 and FIG. 3, a first embodiment of the presentdisclosure provides an optical module, including an electronic assembly1 and an optical assembly 2.

The electronic assembly 1 includes a chip component 11 and a circuitboard 12. The chip component 11 is disposed on the circuit board 12 andis driven by a driving circuit (not shown) in the circuit board 12. Thechip component 11 is selected from a light-emitting chip or an opticalsensor chip, but is not limited thereto. The light-emitting chip can beexemplified as a light-emitting diode (LED), a resonant-cavitylight-emitting diode (RCLED), or a vertical-cavity surface-emittinglaser chip (VCSEL), but is not limited thereto. The optical sensor chipcan be a visible light sensing chip or a non-visible light sensing chip,and can be exemplified but not limited as a CCD chip or a CMOS chip. Thechip being applied can be selected according to particularimplementations and is not limited by the present disclosure.

The electronic assembly 1 can be installed with a detecting circuit (notshown). The detecting circuit can be integrated in the chip component11, be disposed inside the circuit board 12, or be the driving circuititself which drives chip component 11. The configuration of thedetecting circuit can be adjusted according to particularimplementations, and is not restricted hereto.

The optical assembly 2 is disposed on the electronic assembly 1, andincludes a bracket 21 and an optical component 23. The bracket 21includes a surrounding wall 211, a flange 212, and two grooves 213. Theshape of the surrounding wall 211 is substantially a cubic cylinder thatsurrounds the circuit board 12, and surroundingly defines a channel 214.The shape of the surrounding wall 211 can be adjusted according toparticular implementations and is not limited to a cubic cylinder, andcan also be a cylinder, a polygonal cylinder, or the like. The flange212 is in the channel 214 and disposed on the surrounding wall 211, anddefines an accommodating region 215 at the top of the channel 214. Thegrooves 213 are recessed from the surface of the surrounding wall 211,and are disposed at different sides of the surrounding wall 211,respectively. Each groove 213 extends upward from the outside bottom ofthe surrounding wall 211, passing the top of the surrounding wall 211,and extending inward and downward to the flange 212.

The bracket 21 further includes two separated conductive layers 22. Abottom end 221 of each conductive layer 22 is aligned with the bottom ofthe bracket 21 and is electrically connected to the circuit board 12.Each conductive layer 22 includes a connecting end 222 for touching theoptical component 23. The conductive layers 22 are disposed on one ofthe outer surface, the inner surface, and interior of the bracket 21.The position of the conductive layers 22 depends on particularimplementations, and is not limited thereto. When the conductive layers22 are configured on the outer surface or the inner surface of thebracket 21, the conductive layers 22 can be formed on the bracket 21 byelectroless plating or can be directly adhered to the metal sheets, butis not limited thereto. The connecting end 222 may extend to the top ofthe surrounding wall 211, and point toward and contact with the opticalcomponent 23; otherwise, the connecting end 222 may extend to the innersurface of the surrounding wall 211 and be in contact with the opticalcomponent 23. In the first embodiment, the connecting end 222 isexemplified as extending to the inner surface of the surrounding wall211.

It is worth mentioning that the conductive layers 22 can be formed,according to particular implementations, inside the groove 213 oroutside the groove 213. The arrangement of each conductive layer 22 maybe, according to particular implementations, the same or different. Inthe first embodiment, the conductive layers 22 are exemplified as beingdisposed inside the grooves 213, respectively.

Referring to FIG. 2 and FIG. 4, the optical component 23 is disposedinside the accommodating region 215 of the bracket 21, and includes anoptical component body and a light-transmissive conductive layer 24. Theshape of the optical component body complements that of theaccommodating region 215 so that the shape of the optical component bodyis rectangular in the first embodiment. The optical component body has alower surface facing the chip component 11 and an upper surface facingoutside. The optical component body is selected from, but not limitedto, a lens, a prism, or a filter. The lens may be exemplified as aplanar lens, a condensing lens and an astigmatic lens, but is notlimited thereto. The prism may be exemplified as a dispersion prism, areflecting prism, and a polarizing prism, but is not limited thereto.The filter may be exemplified as a circular polarizer (CPL), a neutraldensity filter (ND filter), and a UV filter, but is not limited thereto.The material of the optical component body is transparent plastic orglass. The transparent plastic can be selected frompolymethylmethacrylate (PMMA), polycarbonate (PC), polyetherimide (PEI),cyclo olefin copolymer (COC), or their mixture. For ease of explanation,a planar lens made of glass is taken as an example for the firstembodiment.

The light-transmissive conductive layer 24 extends from one corner ofthe optical component body to another opposite corner thereof. Thelight-transmissive conductive layer 24 includes a main segment 241 andtwo conductive ends 242. The main segment 241 is disposed on the uppersurface or the lower surface of the optical component body. In the firstembodiment, the main segment 241 is exemplified as being disposed on theupper surface. The main segment 241 can be in the shape of S (shown asFIG. 5) or be strip-shaped (shown as FIG. 6). In the first embodiment,an S shape is adopted as an example, but is not limited thereto. Theconductive ends 242 are electrically connected to the conductive layers22, respectively. The conductive ends 242 can be disposed on the samesurface as the main segment 241 (shown as FIG. 3), or on the lateralside of the optical component body. The configuration of the conductiveends 242 is not limited by the present disclosure, as long as theconductive ends 242 can be electrically connected to the connecting end222 of the conductive layer 22. In the first embodiment, the conductiveends 242 are exemplified as being disposed on the upper surface of theoptical component body. The width of the light-transmissive conductivelayer 24 can be longer, shorter, or equal to the width of the conductivelayer 24, and is not limited by the present disclosure. In the firstembodiment, the width of the light-transmissive conductive layer 24 isexemplified as being shorter than the width of the conductive layer.

The light-transmissive conductive layer 24 is made of a material withlight transmission and conductivity, and the material is selected from,but not limited to, metal, indium tin oxide doped tin (In₂O₃: Sn, ITO),tin dioxide doped fluorine (SNO₂: F, FTO), tin dioxide doped yttrium(SNO₂: Sb, ATO), or zinc oxide doped aluminum (ZnO: Al, AZO). When metalis adopted as the material of the light-transmissive conductive layer24, the thickness must be less than 10 nm, and it can be exemplified asgold, silver, platinum, copper, aluminum, chromium, palladium orrhodium, but is not limited thereto. In the first embodiment, ITO istaken as an example.

When the optical component 23 is disposed inside the accommodatingregion 215 of the bracket 21, the conductive ends 242 of thelight-transmissive conductive layer 24 are connected to the connectingends 222 of the conductive layers 22, respectively, that is, theconductive ends 242 are electrically connected to the detecting circuitthrough the conductive layers 22 to form a protection circuit. Bydetecting the resistance or current of the protection circuit throughthe detecting circuit, it can be determined that whether the conductivelayers 22 are electrically connected to the light-transmissiveconductive layer 24. Therefore, when the optical component 23 isloosened and detached from the bracket 21, the light-transmissiveconductive layer 24 would also be detached from the conductive layer 22,and the protection circuit would be opened. At this time, the detectingcircuit detects the open state of the protection circuit, and then shutsdown the driving circuit to stop the operation of the chip component 11,so that the chip component 11 can be prevented from being damaged.Alternatively, when the driving circuit of the chip component 11 is usedas the detecting circuit, the driving circuit can also be shut down byconnecting the protection circuit and the drive circuit in series tostop the operation of the chip component 11 when the light-transmissiveconductive layer 24 is detached from the conductive layer 22.

From the above description, the advantages of the first embodiment canbe further summarized as follows:

A. The circuit of the electronic assembly 1 can detect whether theoptical component 23 is detached from the bracket 21 through theconductive layers 22 disposed on the bracket 21, and can performcorresponding protection measures.

B. The circuit of the electronic assembly 1 can detect whether theoptical component 23 is detached through detecting whether thelight-transmissive conductive layer 24 is electrically conducted to theconductive layers 22, and can perform corresponding protection measures.

C. Through configuring the light-transmissive conductive layer 24 on theupper surface of the optical component body, the worn condition of theoptical component 23 can be detected. Any object scraping against theupper surface of the optical component body, would scrape thelight-transmissive conductive layer 24 at the same time; therefore, thelight-transmissive conductive layer 24 may be scraped off when theoptical component 23 suffers from excessive scraping, which causes theprotection circuit to be opened and in turn stops the operation of thechip component 11.

D. An S shape is adopted as the shape of the light-transmissiveconductive layer 24, to ensure full coverage of the light-transmissiveconductive layer 24 on the optical component body, such as corners,sides, center, and so on. Therefore, this configuration can furtherensure that any object scraping the optical element body would alsoscrape the light-transmitting conductive layer 24 at the same time,thereby improving the ability of detecting the worn condition of theoptical component 23.

E. By disposing the conductive layers 22 inside the grooves 213, theconductive layers 22 can be prevented from being damaged by scraping,which would lead to a stop in the operation of the chip component 11. Inother words, by disposing the conductive layers 22 inside the grooves213, it can be ensured that the protection circuit being opened iscaused by the optical component 23 detaching from the bracket 21, or thelight-transmissive conductive layer 24 being damaged.

F. The conductive ends 242 of the light-transmissive conductive layer 24extending to the lateral side of the optical component body can increasethe contact area with the conductive layer 22, and can ensure aneffective electrical connection therebetween. Therefore, only when theoptical component 23 is almost or completely detached from the bracket21 will the light-transmissive conductive layer 24 not be in contactwith the conductive layers 23, so that the protection circuit becomesopened. Accordingly, this configuration can prevent misjudgment of thedetecting circuit due to any mismatch from shaking between theconductive layers 22 and the light-transmissive conductive layer 24.

G. Since the width of the conductive layer 22 is larger than that of thelight-transmissive conductive layer 24, the conductive layer 22 and thelight-transmissive conductive layer 24 can be electrically connectedwith each other even when production error is factored in.

Second Embodiment

Referring to FIG. 7, a second embodiment of the present disclosure isapproximately the same as the first embodiment, but a main differencebetween the present embodiment and the first embodiment is that theconductive ends 242 of the light-transmissive conductive layer 24 extendto the lateral side of the optical components body, and the conductivelayer 22 is disposed in the interior of the bracket 21. Since theconductive layer 22 is disposed in the interior of the bracket 21, thebracket 21 does not include the grooves 213 (shown at FIG. 2) in thesecond embodiment.

The method by which the conductive layers 22 are disposed inside thebracket 21 can be adjusted based on the material and the process of thebracket 21. When the bracket 21 is made of thermoplastic material, themethod may be: putting the conductive layers 22 in a mold for making thebracket 21, and then injecting the thermoplastic material into the moldand wrapping the conductive layers 22; finally, curing the thermoplasticmaterial to form the bracket 21. When the bracket 21 is made of ceramic,the method may be: inserting the conductive layers 22 into a blank, andthen sintering them together so that the conductive layers 22 are buriedin the bracket 21. However, the method can be adjusted according to anyconventional method and is not limited thereto.

The structure of the conductive layers 22 buried in the bracket 21 canprevent the conductive layers 22 from damage by scraping, and canfurther ensure that the protection circuit being opened is due to theoptical component 23 detaching from the bracket 21 or thelight-transmissive conductive layer 24 being damaged, and is not due tothe conductive layers 22 themselves being damaged.

Therefore, the second embodiment has the same advantages as the firstembodiment, and by burying the conductive layers 22 in the bracket 21,this structure can further ensure the accuracy of detecting whether theoptical component 23 is detached from the bracket 21 or suffering fromexcessive scraping.

Third Embodiment

Referring to FIG. 8, a third embodiment of the present disclosure isapproximately the same as the first embodiment, but a main differencebetween the present embodiment and the first embodiment is that thelight-transmissive conductive layer 24 is disposed on the lower surfaceof the optical component body. Since the connecting ends 222 of theconductive layers 22 are extended near the lower surface of the opticalcomponent body, the connecting ends 222 can be electronically connectedto the light-transmissive conductive layer 24.

Referring to FIG. 9, in another configuration of the third embodiment,the conductive layers 22 are disposed on the inner surface of thebracket 21. The bottom ends 221 are electrically connected to thecircuit board, and the connecting ends 222 extend to the upper side ofthe flange 212 of the bracket 21. Through this configuration, thelight-transmissive conductive layer 24 and the conductive layers 22 canbe bonded and electrically connected with each other.

Therefore, the third embodiment has the same advantages as the firstembodiment except that the worn condition of the optical component 23cannot be detected. Manufacturers can choose any configuration mentionedabove according to particular implementations. When the optical moduleneed not have the function of detecting the worn condition of theoptical component 23, the present embodiment may be applied.Accordingly, the third embodiment provides another technical solutionthat allows the manufacturer to make adjustments according to particularimplementations.

Fourth Embodiment

Referring to FIG. 10, a fourth embodiment of the present disclosure isapproximately the same as the third embodiment, but a main differencebetween the present embodiment and the third embodiment is that theconductive ends 242 of the light-transmissive conductive layer 24 extendto the lateral side of the optical component body, and the conductivelayers 22 are disposed in the interior of the bracket 21. Theconfiguration of the conductive layers 22 is the same as the secondembodiment, and hence is not described herein.

Therefore, the fourth embodiment has the same advantages as the thirdembodiment. Through burying the conductive layers 22 in the bracket 21,this structure can further ensure the accuracy of detecting whether theoptical component 23 is detached from the bracket 21 or whether theoptical component 23 is suffering from excessive scraping.

In conclusion, the conductive layers 22 disposed on the bracket 21 canallow the circuit of circuit board 12 to detect whether the opticalcomponent 23 is detached from the bracket 21, and perform correspondingprotection measures.

The foregoing description of the exemplary embodiments of the disclosurehas been presented only for the purposes of illustration and descriptionand is not intended to be exhaustive or to limit the disclosure to theprecise forms disclosed. Many modifications and variations are possiblein light of the above teaching.

The embodiments were chosen and described in order to explain theprinciples of the disclosure and their practical application so as toenable others skilled in the art to utilize the disclosure and variousembodiments and with various modifications as are suited to theparticular use contemplated. Alternative embodiments will becomeapparent to those skilled in the art to which the present disclosurepertains without departing from its spirit and scope.

What is claimed is:
 1. A bracket adapted to be mounted on a circuitboard and support an optical component, comprising at least twoconductive layers separated from each other; wherein the at least twoconductive layers are electrically connected to the circuit board. 2.The bracket according to claim 1, wherein the conductive layers areconfigured on one of the outer surface, the inner surface, and theinterior of the bracket.
 3. The bracket according to claim 1, whereinthe bracket further includes at least two grooves, each of theconductive layers is respectively disposed in each of the grooves.
 4. Anoptical assembly, comprising: a bracket including at least twoconductive layers separated from each other; and an optical componentdisposed on the bracket, the optical component including at least onelight-transmissive conductive layer which is electrically connected tothe conductive layers.
 5. The optical assembly according to claim 4,wherein the optical component further includes an optical componentbody, the at least one light-transmissive conductive layer is disposedon one of the upper surface and the lower surface of the opticalcomponent body, and the at least one light-transmissive conductive layerincludes two conductive ends disposed on two sides of the opticalcomponent body, respectively; the conductive layers are disposed on oneof the outer surface, the inner surface, and the interior of thebracket; each conductive layer includes a connecting end extending tothe inner surface of the bracket, and being electrically connected tothe correspondingly conductive end; wherein the at least onelight-transmissive conductive layer is electrically disconnected fromthe conductive layers when the optical component is detached from thebracket.
 6. The optical assembly according to claim 4, wherein thebracket includes at least two grooves, and each of the conductive layersis respectively disposed in each of the grooves; the optical componentfurther includes an optical component body on which the at least onelight-transmissive conductive layer is disposed, the shape of theoptical component body is rectangular, and the at least onelight-transmissive conductive layer extends from one corner of theoptical component body to another opposite corner thereof; the at leastone light-transmissive conductive layer is S-shaped or strip-shaped. 7.An optical module, comprising: an electronic assembly including acircuit board and a chip component; and an optical assembly disposed onthe electronic assembly, including a bracket and an optical component;wherein the bracket surrounds the chip component and includes at leasttwo conductive layers separated from each other, the conductive layersare electrically connected to the electronic assembly, the opticalassembly is disposed on the bracket and includes at least onelight-transmissive conductive layer which is electrically connected tothe conductive layers.
 8. The optical module according to claim 7,wherein the optical component further includes an optical componentbody, the at least one light-transmissive conductive layer is disposedon one of the upper surface and the lower surface of the opticalcomponent body, and the at least one light-transmissive conductive layerincludes two conductive ends disposed on two sides of the opticalcomponent body, respectively; the conductive layers are disposed on oneof the outer surface, the inner surface, and the interior of thebracket; each conductive layer includes a connecting end extending tothe inner surface of the bracket, and being electrically connected tothe correspondingly conductive end; wherein the at least onelight-transmissive conductive layer is electrically disconnected fromthe conductive layers when the optical component is detached from thebracket.
 9. The optical module according to claim 7, wherein the bracketincludes at least two grooves, and each conductive layer is respectivelydisposed in each groove; the optical component further includes anoptical component body on which the at least one light-transmissiveconductive layer is disposed, the shape of the optical component body isrectangular, and the at least one light-transmissive conductive layerextends from one corner of the optical component body to anotheropposite corner thereof; the at least one light-transmissive conductivelayer is S-shaped or strip-shaped.
 10. The optical module according toclaim 7, wherein the width of the conductive layer is larger than thewidth of the light-transmissive conductive layer.